The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 08, 2016
Filed:
Oct. 29, 2013
Applied Materials, Inc., Santa Clara, CA (US);
Kun Xu, Sunol, CA (US);
Shih-Haur Shen, Sunnyvale, CA (US);
Boguslaw A. Swedek, Cupertino, CA (US);
Ingemar Carlsson, Milpitas, CA (US);
Doyle E. Bennett, Santa Clara, CA (US);
Wen-Chiang Tu, Mountain View, CA (US);
Hassan G. Iravani, San Jose, CA (US);
Tzu-Yu Liu, San Jose, CA (US);
Applied Materials, Inc., Santa Clara, CA (US);
Abstract
A method of controlling polishing includes polishing a substrate at a first polishing station, monitoring the substrate with a first eddy current monitoring system to generate a first signal, determining an ending value of the first signal for an end of polishing of the substrate at the first polishing station, determining a first temperature at the first polishing station, polishing the substrate at a second polishing station, monitoring the substrate with a second eddy current monitoring system to generate a second signal, determining a starting value of the second signal for a start of polishing of the substrate at the second polishing station, determining a gain for the second polishing station based on the ending value, the starting value and the first temperature, and calculating a third signal based on the second signal and the gain.