The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 08, 2016
Filed:
Nov. 06, 2012
Applicant:
Tokyo Ohka Kogyo Co., Ltd., Kawasaki-shi, JP;
Inventor:
Yoshihiro Inao, Kawasaki, JP;
Assignee:
Tokyo Ohka Kogyo Co., Ltd., Kawasaki-shi, JP;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 21/677 (2006.01); H01L 21/687 (2006.01); H01L 21/683 (2006.01); H01L 21/67 (2006.01);
U.S. Cl.
CPC ...
H01L 21/67742 (2013.01); H01L 21/67766 (2013.01); H01L 21/68707 (2013.01); H01L 21/67092 (2013.01); H01L 21/6838 (2013.01); Y10T 156/10 (2015.01);
Abstract
A substrate processing apparatus including a transfer unit for transferring, under reduced pressure, a laminate including a wafer and a support plate which are bonded to each other and supported by use of support pins that supports an inner periphery of a first surface of the wafer, the first surface being opposite to a second surface of the wafer onto which a second surface the support plate is bonded.