The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 08, 2016
Filed:
Apr. 25, 2008
Janine K. Kardokus, Veradale, WA (US);
Michael Pinter, Spokane, WA (US);
Michael D. Payton, Spokane, WA (US);
Steven (Chi Tse) Wu, Veradale, WA (US);
Jared Akins, Spokane Valley, WA (US);
Werner Hort, Cranberry, PA (US);
Janine K. Kardokus, Veradale, WA (US);
Michael Pinter, Spokane, WA (US);
Michael D. Payton, Spokane, WA (US);
Steven (Chi Tse) Wu, Veradale, WA (US);
Jared Akins, Spokane Valley, WA (US);
Werner Hort, Cranberry, PA (US);
Honeywell International Inc., Morris Plains, NJ (US);
Abstract
Sputtering targets having a reduced burn-in time are disclosed that comprise: a) a heat-modified surface material having a substantially uniform crystallographic orientation, wherein at least part of the surface material was melted during heat-treatment, and b) a core material having an average grain size. Sputtering targets are also disclosed that include a heat-modified surface material having network of shallow trenches, alternating rounded peaks and valleys in the surface of the target or a combination thereof, wherein at least part of the surface material was melted during heat-treatment, and a core material having an average grain size. Methods of producing sputtering targets having reduced burn-in times comprises: a) providing a sputtering target comprising a sputtering surface having a sputter material and a crystal lattice, and b) heat-modifying the sputtering surface in order to melt at least part of the surface material and modify the crystal lattice. Methods of producing a sputtering target having a reduced burn-in time are also disclosed comprising: providing a sputtering target having a sputtering surface, wherein the sputtering surface comprises a damage layer, and modifying the sputtering surface by deplating a layer of material, pulsed-plating a layer of material or a combination thereof.