The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 01, 2016

Filed:

Oct. 20, 2014
Applicant:

Semiconductor Energy Laboratory Co., Ltd., Kanagawa-ken, JP;

Inventors:

Yasutaka Nakazawa, Tochigi, JP;

Shunsuke Koshioka, Tochigi, JP;

Takayuki Cho, Tochigi, JP;

Takahiro Sato, Tochigi, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/00 (2006.01); H01L 29/786 (2006.01); H01L 21/4763 (2006.01); H01L 21/3213 (2006.01); C23F 1/02 (2006.01); C23F 1/18 (2006.01); C23F 1/26 (2006.01); C09K 13/00 (2006.01);
U.S. Cl.
CPC ...
H01L 29/7869 (2013.01); C23F 1/02 (2013.01); C23F 1/18 (2013.01); C23F 1/26 (2013.01); H01L 21/32134 (2013.01); H01L 21/47635 (2013.01); C09K 13/00 (2013.01);
Abstract

A method for manufacturing a semiconductor device includes the steps of forming a first conductive film over a substrate; forming an insulating film over the first conductive film; forming an oxide semiconductor film over the insulating film to overlap with the first conductive film; forming a second conductive film including a metal film containing molybdenum as its main component and a metal film containing copper as its main component over the oxide semiconductor film; and etching the second conductive film by an etchant. At the time of etching the second conductive film by the etchant, the oxide semiconductor film is used as an etching stopper film. In addition, the etchant which can be used for a transistor including the oxide semiconductor film is provided.


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