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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 9276023 B1

PDFFull Text
Date of Patent:
Mar. 01, 2016

Filed:

Nov. 30, 2012

Image pickup element housing package, and image pickup device

Applicant:

Kyocera Corporation, Kyoto-shi, Kyoto, JP;

Inventors:

Hiroshi Yamada, Satsumasendai, JP;

Akihiko Funahashi, Kagoshima, JP;

Yousuke Moriyama, Satsumasendai, JP;

Assignee:

KYOCERA CORPORATION, Kyoto-Shi, Kyoto, JP;

Attorney:

Volpe and Koenig, P.C.

Primary Examiner:

Victor A Mandala

Int. Cl.
CPC ...
H01L 27/14 (2006.01); H01L 27/146 (2006.01); H01L 31/0203 (2014.01); H01L 23/08 (2006.01); H04N 5/225 (2006.01); H01L 31/0232 (2014.01);
U.S. Cl.
CPC ...
H01L 27/14601 (2013.01); H01L 23/08 (2013.01); H01L 27/14618 (2013.01); H01L 31/0203 (2013.01); H01L 31/0232 (2013.01); H04N 5/2253 (2013.01); H04N 5/2257 (2013.01); H01L 2224/4824 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/49175 (2013.01);
Abstract

An imaging device accommodating package includes an insulating base body and an imaging device connecting pad. The insulating base body includes a lower surface, a through-hole and a bonding area on the bottom surface of the recess. The lower surface includes a recess. The through-hole is formed in a bottom surface of the recess in a perspective plan view. The bonding area is used for an imaging device. The imaging device connecting pad is formed on an upper surface of the insulating base body or on an inner surface of the through-hole.

Find Patent Forward Citations

Yamada, Hiroshi. (2016). Image pickup element housing package, and image pickup device (U.S. Patent No. 9276023). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/9276023

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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