The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 01, 2016
Filed:
Oct. 29, 2013
Applied Materials, Inc., Santa Clara, CA (US);
Kun Xu, Sunol, CA (US);
Shih-Haur Shen, Sunnyvale, CA (US);
Boguslaw A. Swedek, Cupertino, CA (US);
Ingemar Carlsson, Milpitas, CA (US);
Doyle E. Bennett, Santa Clara, CA (US);
Wen-Chiang Tu, Mountain View, CA (US);
Hassan G. Iravani, San Jose, CA (US);
Tzu-Yu Liu, San Jose, CA (US);
Applied Materials, Inc., Santa Clara, CA (US);
Abstract
In one aspect, a method of controlling polishing includes receiving a measurement of an initial thickness of a conductive film on a first substrate prior to polishing the first substrate from an in-line or stand-alone monitoring system, polishing one or more substrates in a polishing system, the one or more substrates including the first substrate, during polishing of the one or more substrates, monitoring the one or more substrates with an eddy current monitoring system to generate a first signal, determining a starting value of the first signal for a start of polishing of the first substrate, determining a gain based on the starting value and the measurement of the initial thickness, for at least a portion of the first signal collected during polishing of at least one substrate of the one or more substrates, and calculating a second signal based on the first signal and the gain.