The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 9275889 B1

PDF
Full Text
Expired
Date of Patent:
Mar. 01, 2016

Filed:

Oct. 03, 2013
Applicant:

Globalfoundries Inc., Grand Cayman, KY;

Inventors:

Ryan Kim, Albany, NY (US);

Jason R. Cantone, Mechanicville, NY (US);

Wenhui Wang, Clifton Park, NY (US);

Assignee:

GLOBALFOUNDRIES INC., Grand Cayman, KY;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/4763 (2006.01); H01L 21/74 (2006.01); H01L 27/11 (2006.01); H01L 21/8234 (2006.01); H01L 27/02 (2006.01);
U.S. Cl.
CPC ...
H01L 21/743 (2013.01); H01L 21/823475 (2013.01); H01L 21/823481 (2013.01); H01L 27/0207 (2013.01); H01L 27/11 (2013.01);
Abstract

A methodology for forming contact areas by a multiple patterning process that provides increased yield and lower risk of contact-to-contact short at points of tight tip-to-tip spacing and the resulting device are disclosed. Embodiments include forming one or more trench patterning layers on a planarized surface of a wafer, forming one or more trenches in the one or more trench patterning layers, forming a block mask at one or more points along the one or more trenches, extending the one or more trenches down to a substrate level of the wafer, and removing the block mask from the one or more points.


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