The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 01, 2016
Filed:
Feb. 26, 2014
Kla-tencor Corporation, Milpitas, CA (US);
Vijayakumar Ramachandran, Sunnyvale, CA (US);
KLA-Tencor Corp., Milpitas, CA (US);
Abstract
Systems and methods for classifying defects on a wafer are provided. One method includes dilating an extended bounding box (EBB) surrounding a defect position on a wafer in two dimensions in proportion to a width and height of a pattern of interest (POI) for a hot spot closest to the defect position. The method also includes determining if polygons in the POI match polygons in the dilated bounding box. If the polygons in the POI do not match the polygons in the dilated bounding box, the defect is classified as a non-hot spot defect. If the polygons in the POI match the polygons in the dilated bounding box, the defect is classified as a hot spot defect if the area of the EBB intersects the area of interest associated with the hot spot and a non-hot spot defect if the EBB area does not intersect the area of interest.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile