The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 23, 2016

Filed:

Jun. 07, 2012
Applicants:

Yutaka Nishioka, Shizuoka, JP;

Kazumasa Horita, Shizuoka, JP;

Natsuki Fukuda, Shizuoka, JP;

Shin Kikuchi, Shizuoka, JP;

Youhei Ogawa, Shizuoka, JP;

Koukou Suu, Shizuoka, JP;

Inventors:

Yutaka Nishioka, Shizuoka, JP;

Kazumasa Horita, Shizuoka, JP;

Natsuki Fukuda, Shizuoka, JP;

Shin Kikuchi, Shizuoka, JP;

Youhei Ogawa, Shizuoka, JP;

Koukou Suu, Shizuoka, JP;

Assignee:

ULVAC, INC., Kanagawa, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C23C 14/24 (2006.01); H01L 45/00 (2006.01); C23C 14/54 (2006.01); C23C 14/08 (2006.01); C23C 14/34 (2006.01); H01J 37/34 (2006.01); H01L 27/10 (2006.01);
U.S. Cl.
CPC ...
H01L 45/1625 (2013.01); C23C 14/08 (2013.01); C23C 14/3464 (2013.01); C23C 14/3492 (2013.01); C23C 14/542 (2013.01); C23C 14/548 (2013.01); H01J 37/34 (2013.01); H01J 37/3426 (2013.01); H01J 37/3429 (2013.01); H01L 27/101 (2013.01); H01L 45/04 (2013.01); H01L 45/146 (2013.01);
Abstract

[Object] To provide a method and an apparatus for manufacturing a variable resistance element by which a metal oxide layer having a desired resistivity can be precisely formed. [Solving Means] The method of manufacturing the variable resistance element according to an embodiment of the present invention includes a step of forming a first metal oxide having a first resistivity and a step of forming a second metal oxide having a second resistivity different from the first resistivity. The first metal oxide is formed on a substrate by sputtering, while sputtering a first target made of an oxide of metal, a second target made of the metal with a first power. The second metal oxide layer is formed on the first metal oxide layer by sputtering the second target with a second power different from the first power while sputtering the first target.


Find Patent Forward Citations

Loading…