The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 23, 2016

Filed:

Mar. 13, 2015
Applicant:

Kabushiki Kaisha Toshiba, Minato-ku, JP;

Inventors:

Nobuhito Kuge, Yokkaichi, JP;

Hiroshi Akahori, Yokkaichi, JP;

Assignee:

KABUSHIKI KAISHA TOSHIBA, Minato-ku, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/8234 (2006.01); H01L 27/115 (2006.01); H01L 21/311 (2006.01);
U.S. Cl.
CPC ...
H01L 27/11524 (2013.01); H01L 21/31105 (2013.01); H01L 27/1157 (2013.01);
Abstract

In accordance with an embodiment, a manufacturing method of a semiconductor device includes: forming memory cells and select transistors on a semiconductor substrate configured to select any memory cell, forming a first insulating nitride film, forming a contact, and selectively removing the first insulating nitride film. The first insulating nitride film is formed so as to cover the semiconductor substrate between the select transistors adjacent in the first direction, the select transistors, and the memory cells. The first insulating nitride film is selectively removed in a region other than the region in which the contact is formed and in a region above the select transistors or the memory cells.


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