The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 23, 2016
Filed:
Oct. 25, 2012
Applicant:
United Microelectronics Corp., Hsin-Chu, TW;
Inventor:
Ye Wang, Singapore, SG;
Assignee:
UNITED MICROELECTRONICS CORP., Science-Based Industrial Park , Hsin-Chu, TW;
Attorneys:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H05K 1/03 (2006.01); H05K 1/09 (2006.01); H05K 3/22 (2006.01); H05K 1/02 (2006.01); H01L 23/00 (2006.01); H01L 23/31 (2006.01); H01L 21/44 (2006.01); H01L 21/28 (2006.01); H01L 23/48 (2006.01);
U.S. Cl.
CPC ...
H01L 24/05 (2013.01); H01L 23/3192 (2013.01); H01L 24/03 (2013.01); H01L 2224/03009 (2013.01); H01L 2224/0345 (2013.01); H01L 2224/0362 (2013.01); H01L 2224/0401 (2013.01); H01L 2224/04042 (2013.01); H01L 2224/05567 (2013.01); H01L 2224/05572 (2013.01);
Abstract
A method of manufacturing a bond pad structure, comprising the steps of forming a pad material layer on a passivation layer, forming a protection layer on the pad material layer, performing an etching process to pattern the protection layer and the pad material layer into a bond pad structure, and removing the protection layer on the bond pad structure.