The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 23, 2016
Filed:
Oct. 22, 2013
Applicant:
Rohm and Haas Electronic Materials Llc, Marlborough, MA (US);
Inventors:
Mark S. Oliver, Charlestown, MA (US);
Michael K. Gallagher, Hopkinton, MA (US);
Karen R. Brantl, West Springfield, MA (US);
Assignee:
Rohm and Haas Electronic Materials LLC, Marlborough, MA (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/00 (2006.01); H01L 21/78 (2006.01); C09J 5/00 (2006.01); H01L 21/683 (2006.01); H01L 29/06 (2006.01);
U.S. Cl.
CPC ...
H01L 21/78 (2013.01); C09J 5/00 (2013.01); H01L 21/6835 (2013.01); H01L 29/06 (2013.01); C09J 2203/326 (2013.01); C09J 2205/302 (2013.01); C09J 2423/00 (2013.01); C09J 2471/00 (2013.01); H01L 2221/6834 (2013.01); H01L 2221/68318 (2013.01); H01L 2221/68327 (2013.01); H01L 2221/68381 (2013.01);
Abstract
Compositions containing an adhesive material and a release additive are suitable for temporarily bonding two surfaces, such as a wafer active side and a substrate. These compositions are useful in the manufacture of electronic devices where a component, such as an active wafer, is temporarily bonded to a substrate, followed by further processing of the active wafer.