The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 23, 2016
Filed:
Jul. 03, 2013
Sumco Corporation, Tokyo, JP;
Tomonori Kawasaki, Tokyo, JP;
SUMCO Corporation, Tokyo, JP;
Abstract
A method of polishing one side of a wafer, which makes it possible to accurately realize the desired wafer edge shape without dependence on the period of use of a polishing cloth, is provided. In the method according to the present invention, a wafer fixed to a head is brought into contact with a polishing cloth provided on a surface of a surface plate, and the head and the surface plate are rotated, thereby polishing one side of the wafer, the method including the steps of measuring a contact angle of the polishing cloth (S); determining a rotation speed of the head and the surface plate, based on the measured contact angle of the polishing cloth (S); and polishing the one side of the wafer by rotating the head and the surface plate at the determined rotation speed (S, S).
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile