The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 16, 2016

Filed:

Jan. 27, 2012
Applicants:

Yasuhiko Mano, Ogaki, JP;

Shinobu Kato, Ogaki, JP;

Takashi Kariya, Ogaki, JP;

Inventors:

Yasuhiko Mano, Ogaki, JP;

Shinobu Kato, Ogaki, JP;

Takashi Kariya, Ogaki, JP;

Assignee:

IBIDEN Co., Ltd., Ogaki-shi, JP;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H05K 3/46 (2006.01); H05K 1/18 (2006.01); H01F 17/00 (2006.01); H05K 3/00 (2006.01);
U.S. Cl.
CPC ...
H05K 3/4602 (2013.01); H01F 17/0033 (2013.01); H05K 1/185 (2013.01); H01F 2017/004 (2013.01); H05K 3/0032 (2013.01); H05K 2201/1003 (2013.01); H05K 2203/1469 (2013.01); H05K 2203/1572 (2013.01); Y10T 29/4913 (2015.01);
Abstract

A printed wiring board includes a core substrate having a cavity and having first and second surfaces, an inductor component accommodated in the cavity, a filler resin filling a gap formed between the substrate and component in the cavity, and a buildup layer formed on the first surface of the substrate and the component. The component has a coil layer, a second insulation layer formed on the coil layer, an electrode formed on the substance layer, and a via conductor formed in the substance layer and connecting the coil layer and the electrode, the component is accommodated in the cavity such that the electrode faces the first surface of the substrate, and the buildup layer includes an interlayer insulation layer formed on the first surface of the substrate and the component, a conductive layer formed on the insulation layer, and a connection via conductor connecting the conductive layer and electrode.


Find Patent Forward Citations

Loading…