The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 16, 2016
Filed:
Oct. 15, 2014
Honda Motor Co., Ltd., Tokyo, JP;
Fuji Electric Co., Ltd., Kawasaki-shi, Kanagawa, JP;
Takaki Nakagawa, Wako, JP;
Daisuke Takeuchi, Wako, JP;
Yasuhiro Maeda, Wako, JP;
Hiromichi Gohara, Kawasaki, JP;
Akira Morozumi, Kawasaki, JP;
Takeshi Ichimura, Kawasaki, JP;
HONDA MOTOR CO., LTD., Tokyo, JP;
FUJI ELECTRIC CO., LTD., Kawasaki-Shi, JP;
Abstract
Provided is a semiconductor device comprising a cooler in which, by improving the shape of the connecting portions of an inlet/outlet of a coolant or the like, the pressure loss in the connecting portion or the like can be reduced. A coolerof a semiconductor deviceincludes: an inletand an outletprovided on side wallsof a caseopposing to each other at diagonal positions; an introduction pathwhich is connected to the inletand formed in the case; a discharge pathwhich is connected to the outletand formed in the case; and a cooling flow channelbetween the introduction pathand the discharge path. The height of the opening of the inletis larger than the height of the introduction path, and a connecting portionbetween the inletand the introduction pathincludes an inclined surfacewhich is inclined from the bottom surface of the connecting portiontoward the longitudinal direction of the introduction path