The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 09, 2016
Filed:
Dec. 12, 2012
Applicant:
Shinko Electric Industries Co., Ltd., Nagano-shi, Nagano, JP;
Inventor:
Kentaro Kaneko, Nagano, JP;
Assignee:
SHINKO ELECTRIC INDUSTRIES CO., LTD., Nagano-Shi, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 3/00 (2006.01); H05K 3/10 (2006.01); H05K 1/11 (2006.01); H05K 3/24 (2006.01); H05K 3/06 (2006.01); H05K 3/40 (2006.01); H01L 23/498 (2006.01); H05K 3/20 (2006.01); H05K 3/46 (2006.01); H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
H05K 3/007 (2013.01); H01L 23/49811 (2013.01); H01L 23/49838 (2013.01); H05K 1/113 (2013.01); H05K 3/06 (2013.01); H05K 3/243 (2013.01); H05K 3/4038 (2013.01); H01L 23/498 (2013.01); H01L 23/49822 (2013.01); H01L 24/48 (2013.01); H01L 2221/68345 (2013.01); H01L 2224/16 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/48227 (2013.01); H01L 2924/01046 (2013.01); H01L 2924/01078 (2013.01); H01L 2924/01079 (2013.01); H01L 2924/12042 (2013.01); H05K 3/205 (2013.01); H05K 3/4644 (2013.01); H05K 2201/09472 (2013.01); H05K 2201/09845 (2013.01); H05K 2203/0376 (2013.01); Y10T 29/49155 (2015.01); Y10T 29/49156 (2015.01); Y10T 29/49165 (2015.01); Y10T 29/49224 (2015.01);
Abstract
A method of fabricating a wiring board includes forming a surface plating layer on a support member, and forming an external connecting pad on the surface plating layer formed on the support member such that an area of the external connecting pad formed on the surface plating layer is smaller than an area of the surface plating layer. The method also includes forming an insulating layer and a wiring layer on a surface of the support member where the external connecting pad is formed, and removing the support member.