The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 09, 2016

Filed:

May. 31, 2012
Applicants:

Teruyuki Ishihara, Ogaki, JP;

Hidetoshi Noguchi, Ogaki, JP;

Hirofumi Futamura, Ogaki, JP;

Inventors:

Teruyuki Ishihara, Ogaki, JP;

Hidetoshi Noguchi, Ogaki, JP;

Hirofumi Futamura, Ogaki, JP;

Assignee:

IBIDEN CO., LTD., Ogaki-shi, JP;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H05K 1/02 (2006.01); H05K 1/18 (2006.01); H05K 3/34 (2006.01); H05K 3/46 (2006.01);
U.S. Cl.
CPC ...
H05K 1/183 (2013.01); H05K 3/4697 (2013.01); H05K 3/3452 (2013.01); H05K 3/4691 (2013.01); H05K 2201/09036 (2013.01); H05K 2201/09063 (2013.01); H05K 2201/09127 (2013.01); H05K 2201/09136 (2013.01); H05K 2201/09854 (2013.01); Y10T 29/49128 (2015.01);
Abstract

A wiring board has a laminated structure having a recessed portion on a first-surface side of the laminated structure and a solder resist layer on a second-surface side of the laminated structure on the opposite side of the first-surface side. The laminated structure has a first-surface side pad formed in the bottom of the recessed portion and a second-surface side pad formed on the second-surface side of the laminated structure, the solder resist layer has a first opening portion and a second opening portion formed in the solder resist layer, the first opening portion is exposing the second-surface side pad, the second opening portion is formed on a back face of the recessed portion, and the back face of the recessed portion does not include the second-surface side pad.


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