The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 09, 2016
Filed:
Jun. 03, 2014
Stmicroelectronics, Inc., Calamba, Laguna, PH;
STMicroelectronics, Inc., Calamba, PH;
Abstract
Delamination of stacked integrated circuit die configurations on printed circuit boards is avoided by providing a metal trace support structure underneath the die stack. The metal trace support structure features substantially equally spaced thin metal traces in place of a contiguous metal plate which has been used in the past. Spaced apart thin metal traces are less vulnerable to thermal expansion than a metal plate which has a large thermal mass. The metal traces still provide structural stability, while preventing delamination of the die stack configuration during thermal processing. A method of attaching a bridge die stack configuration to a printed circuit board by adhering a die attach film to a field of metal traces is demonstrated. In addition, the electrical and structural integrity of the bridge die stack formed with a metal trace support structure is confirmed with test results.