The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 09, 2016
Filed:
Jan. 22, 2014
Applicant:
Hon Hai Precision Industry Co., Ltd., New Taipei, TW;
Inventor:
Hao-Yun Ma, San Jose, CA (US);
Assignee:
FOXCONN INTERCONNECT TECHNOLOGY LIMITED, Grand Cayman, KY;
Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/40 (2006.01); H05K 7/20 (2006.01); H05K 1/02 (2006.01); H01L 23/34 (2006.01); H05K 3/30 (2006.01);
U.S. Cl.
CPC ...
H05K 1/0203 (2013.01); H01L 23/34 (2013.01); H01L 23/40 (2013.01); H05K 3/301 (2013.01); H05K 2201/066 (2013.01); H05K 2201/10393 (2013.01); H05K 2201/2045 (2013.01); H05K 2201/2072 (2013.01);
Abstract
An electronic device includes a printed circuit board having a top surface, a clip member, a heat sink mounted on the top surface of the printed circuit board, and an anchor having a mounting portion with a solder surface for soldering to the top surface of the printed circuit board and a hook portion used to lock the clip member assembled to the heat sink. The solder surface is mounted to the top surface of the printed circuit board by surface mount technique (SMT).