The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 09, 2016
Filed:
Mar. 04, 2015
Applicant:
Xiamen Sanan Optoelectronics Technology Co., Ltd., Xiamen, CN;
Inventors:
Chaoyu Wu, Xiamen, CN;
Chun-I Wu, Xiamen, CN;
Shuying Qiu, Xiamen, CN;
Yi-Yen Chen, Xiamen, CN;
Ching-Shan Tao, Xiamen, CN;
Wenbi Cai, Xiamen, CN;
Assignee:
XIAMEN SANAN OPTOELECTRONICS TECHNOLOGY CO., LTD., Xiamen, CN;
Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H01L 33/46 (2010.01); H01L 25/075 (2006.01); H01L 33/00 (2010.01); H01L 33/22 (2010.01); H01L 33/32 (2010.01); H01L 33/50 (2010.01); H01L 33/40 (2010.01); H01L 33/38 (2010.01);
U.S. Cl.
CPC ...
H01L 33/46 (2013.01); H01L 25/0756 (2013.01); H01L 33/007 (2013.01); H01L 33/0079 (2013.01); H01L 33/0095 (2013.01); H01L 33/22 (2013.01); H01L 33/32 (2013.01); H01L 33/405 (2013.01); H01L 33/505 (2013.01); H01L 33/387 (2013.01); H01L 2224/06 (2013.01); H01L 2924/0002 (2013.01); H01L 2933/0025 (2013.01); H01L 2933/0041 (2013.01);
Abstract
A warm-white-light LED structure combines a red light wafer and a blue light wafer via a bonding layer. A reflecting layer is arranged over upper and lower surfaces of the bonding layer respectively; the lower surface of the red light wafer takes up one-third or less of the upper surface of the blue light wafer, which effectively reduces packaging structure volume and time of bondings so as to optimize process flow and save fabrication cost.