The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 09, 2016

Filed:

Jan. 20, 2015
Applicant:

Macronix International Co., Ltd., Hsinchu, TW;

Inventors:

Wing-Chor Chan, Hsinchu, TW;

Shyi-Yuan Wu, Hsinchu, TW;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 29/76 (2006.01); H01L 29/94 (2006.01); H01L 31/062 (2012.01); H01L 31/113 (2006.01); H01L 31/119 (2006.01); H01L 29/66 (2006.01); H01L 29/78 (2006.01); H01L 21/265 (2006.01); H01L 21/225 (2006.01); H01L 21/311 (2006.01); H01L 29/06 (2006.01); H01L 29/08 (2006.01); H01L 29/10 (2006.01);
U.S. Cl.
CPC ...
H01L 29/66681 (2013.01); H01L 21/225 (2013.01); H01L 21/265 (2013.01); H01L 21/26546 (2013.01); H01L 21/31111 (2013.01); H01L 29/0638 (2013.01); H01L 29/0653 (2013.01); H01L 29/0878 (2013.01); H01L 29/1095 (2013.01); H01L 29/66575 (2013.01); H01L 29/66659 (2013.01); H01L 29/7816 (2013.01);
Abstract

A semiconductor device, in particular, an extended drain metal oxide semiconductor (ED-MOS) device, defined by a doped shallow drain implant in a drift region. For example, an extend drain n-channel metal oxide semiconductor (ED-NMOS) device is defined by an n doped shallow drain (NDD) implant in the drift region. The device is also characterized by conductive layer separated from a substrate in part by a thin oxide layer and in another part by a thick/thin oxide layer. A method of fabricating a semiconductor device, in particular an ED-NMOS device, having a doped shallow drain implant of a drift region is also provided. A method is also provided for fabricating conductive layer disposed in part across a thin oxide layer and in another part across a thick/thin oxide layer.


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