The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 09, 2016
Filed:
Sep. 19, 2013
Stmicroelectronics (Malta) Ltd, Kirkop, MT;
Stmicroelectronics Pte Ltd, Singapore, SG;
Roseanne Duca, Ghaxaq, MT;
Kim-Yong Goh, Singapore, SG;
Xueren Zhang, Singapore, SG;
Kevin Formosa, Zabbar Malta, MT;
STMicroelectronics (Mala) Ltd, Kirkop, MT;
STMicroelectronics Pte Ltd, Singapore, SG;
Abstract
A surface mount package of a semiconductor device, has: an encapsulation, housing at least one die including semiconductor material; and electrical contact leads, protruding from the encapsulation to be electrically coupled to contact pads of a circuit board; the encapsulation has a main face designed to face a top surface of the circuit board, which is provided with coupling features designed for mechanical coupling to the circuit board to increase a resonant frequency of the mounted package. The coupling features envisage at least a first coupling recess defined within the encapsulation starting from the main face, designed to be engaged by a corresponding coupling element fixed to the circuit board, thereby restricting movements of the mounted package.