The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 09, 2016

Filed:

Apr. 15, 2014
Applicant:

Globalfoundries Singapore Pte. Ltd., Singapore, SG;

Inventors:

Gek Soon Chua, Singapore, SG;

Tan Soon Yoeng, Singapore, SG;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/44 (2006.01); H01L 21/027 (2006.01); H01L 21/768 (2006.01); H01L 21/02 (2006.01); H01L 27/02 (2006.01); H01L 21/3213 (2006.01); H01L 21/66 (2006.01);
U.S. Cl.
CPC ...
H01L 21/0274 (2013.01); H01L 21/02348 (2013.01); H01L 21/32139 (2013.01); H01L 21/76894 (2013.01); H01L 22/12 (2013.01); H01L 27/0203 (2013.01);
Abstract

Methods for extreme ultraviolet (EUV) mask defect mitigation by using multi-patterning lithography techniques. In one exemplary embodiment, a method for fabricating an integrated circuit including identifying a position of a defect in a first EUV photolithographic mask, the photolithographic mask including a desired pattern and transferring the desired pattern to a photoresist material disposed on a semiconductor substrate. Transferring the desired pattern further transfers an error pattern feature to the photoresist material as a result of the defect in the first EUV photolithographic mask. The method further includes, using a second photolithographic mask, transferring a trim pattern to the photoresist material, wherein the trim pattern removes the error pattern feature from the photoresist material.


Find Patent Forward Citations

Loading…