The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 09, 2016

Filed:

Mar. 27, 2008
Applicants:

Urs T. Duerig, Rueschlikon, CH;

Jane Elizabeth Frommer, San Jose, CA (US);

Bernd Walter Gotsmann, Horgen, CH;

Erik Christopher Hagberg, Evansville, IN (US);

James Lupton Hedrick, Pleasanton, CA (US);

Armin W. Knoll, Adliswil, CH;

Teddie Peregrino Magbitang, San Jose, CA (US);

Robert Dennis Miller, San Jose, CA (US);

Russell Clayton Pratt, Los Gatos, CA (US);

Charles Gordon Wade, Los Gatos, CA (US);

Inventors:

Urs T. Duerig, Rueschlikon, CH;

Jane Elizabeth Frommer, San Jose, CA (US);

Bernd Walter Gotsmann, Horgen, CH;

Erik Christopher Hagberg, Evansville, IN (US);

James Lupton Hedrick, Pleasanton, CA (US);

Armin W. Knoll, Adliswil, CH;

Teddie Peregrino Magbitang, San Jose, CA (US);

Robert Dennis Miller, San Jose, CA (US);

Russell Clayton Pratt, Los Gatos, CA (US);

Charles Gordon Wade, Los Gatos, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C08G 73/10 (2006.01);
U.S. Cl.
CPC ...
C08G 73/1085 (2013.01); C08G 73/101 (2013.01); C08G 73/1064 (2013.01);
Abstract

A composition of matter for a recording medium in atomic force data storage devices. The composition includes polyimide oligomers having covalently bonded monomers forming a backbone, the oligomer thermally stable to at least 400° C.; one or more covalent bonding cross-linking moieties incorporated into the polyimide oligomer; and one or more hydrogen bonding cross-linking moieties incorporated into the polyimide oligomer. The covalent and hydrogen bonding cross-linking of the polyimide oligomers may be tuned to match thermal and force parameters required in read-write-erase cycles.


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