The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 02, 2016

Filed:

Oct. 31, 2013
Applicant:

General Electric Company, Schenectady, NY (US);

Inventors:

Joo Han Kim, Niskayuna, NY (US);

Hendrik Pieter Jacobus de Bock, Clifton Park, NY (US);

Jay Todd Labhart, Cary, NC (US);

Shakti Singh Chauhan, Guilderland, NY (US);

Graham Charles Kirk, Milton Keynes, GB;

Stuart Connolly, Northampton, GB;

Assignee:

General Electric Company, Niskayuna, NY (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H05K 7/20 (2006.01); H01S 4/00 (2006.01); F28F 7/00 (2006.01); F28D 15/00 (2006.01); H01R 13/00 (2006.01); H05K 1/02 (2006.01); H05K 7/14 (2006.01);
U.S. Cl.
CPC ...
H05K 1/0203 (2013.01); H05K 7/1461 (2013.01); H05K 7/20672 (2013.01); Y10T 29/49002 (2015.01);
Abstract

A circuit card assembly is provided. The circuit card assembly includes a printed circuit board, at least one electronic component mounted on the printed circuit board, and a frame coupled to the printed circuit board such that the electronic component is disposed between the printed circuit board and the frame. The circuit card assembly also includes a heat transfer device coupled to the frame. The heat transfer device has a heat pipe disposed at least in part between the frame and the printed circuit board. The circuit card assembly further includes a pivotable brace biasing the heat pipe toward the electronic component to facilitate cooling the electronic component.


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