The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 02, 2016

Filed:

Jun. 15, 2012
Applicants:

Mohsen Askarinya, Chandler, AZ (US);

Andreas A. Fenner, Chandler, AZ (US);

Erik J. Herrmann, Mesa, AZ (US);

David A. Ruben, Mesa, AZ (US);

John K. Day, Chandler, AZ (US);

Inventors:

Mohsen Askarinya, Chandler, AZ (US);

Andreas A. Fenner, Chandler, AZ (US);

Erik J. Herrmann, Mesa, AZ (US);

David A. Ruben, Mesa, AZ (US);

John K. Day, Chandler, AZ (US);

Assignee:

Medtronic, Inc., Minneapolis, MN (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01M 2/10 (2006.01); H01M 2/20 (2006.01); H01M 2/24 (2006.01); H01M 2/26 (2006.01); H01M 10/0562 (2010.01); H01M 10/0585 (2010.01); H01M 10/647 (2014.01); H01M 6/40 (2006.01); H01M 6/46 (2006.01); H01M 2/22 (2006.01); H01M 10/04 (2006.01); H01M 10/0525 (2010.01); A61N 1/378 (2006.01); A61N 1/375 (2006.01);
U.S. Cl.
CPC ...
H01M 2/204 (2013.01); A61N 1/378 (2013.01); H01M 2/1066 (2013.01); H01M 2/202 (2013.01); H01M 2/22 (2013.01); H01M 2/24 (2013.01); H01M 2/266 (2013.01); H01M 6/40 (2013.01); H01M 6/46 (2013.01); H01M 10/0436 (2013.01); H01M 10/0525 (2013.01); H01M 10/0562 (2013.01); H01M 10/0585 (2013.01); H01M 10/647 (2015.04); A61N 1/3758 (2013.01); Y02E 60/122 (2013.01); Y10T 29/49112 (2015.01);
Abstract

Arrays of planar solid state batteries are stacked in an aligned arrangement for subsequent separation into individual battery stacks. Prior to stacking, a redistribution layer (RDL) is formed over a surface of each wafer that contains an array; each RDL includes first and second groups of conductive traces, each of the first extending laterally from a corresponding positive battery contact, and each of the second extending laterally from a corresponding negative battery contact. Conductive vias, formed before or after stacking, ultimately couple together corresponding contacts of aligned batteries. If before, each via extends through a corresponding battery contact of each wafer and is coupled to a corresponding conductive layer that is included in another RDL formed over an opposite surface of each wafer. If after, each via extends through corresponding aligned conductive traces and, upon separation of individual battery stacks, becomes an exposed conductive channel of a corresponding battery stack.


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