The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 02, 2016
Filed:
Dec. 06, 2011
Chih-wei Hsu, Chuang-Hua, TW;
Mei-jen Wu, Hsin-Chu, TW;
Yen-di Tsen, Chung-Ho, TW;
JO Fei Wang, Hsin-Chu, TW;
Jong-i Mou, Hsinpu Township, Hsinchu County, TW;
Chin-hsiang Lin, Hsin-chu, TW;
Chih-Wei Hsu, Chuang-Hua, TW;
Mei-Jen Wu, Hsin-Chu, TW;
Yen-Di Tsen, Chung-Ho, TW;
Jo Fei Wang, Hsin-Chu, TW;
Jong-I Mou, Hsinpu Township, Hsinchu County, TW;
Chin-Hsiang Lin, Hsin-chu, TW;
Taiwan Semiconductor Manufacturing Co., Ltd., Hsin-Chu, TW;
Abstract
A system and method of automatically calculating boundaries for a semiconductor fabrication process. The method includes selecting a first parameter for monitoring during a semiconductor fabrication process. A first set of values for the first parameter are received and a group value of the first set is determined. Each value in the first set of values is normalized. A first weighting factor is selected based on a number of values in the first set. The embodiment also includes generating a first and a second boundary value as a function of the weighting factor, the first set normalized values and the group value of the first set and applying the first and second boundary values to control the semiconductor fabrication process.