The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 26, 2016
Filed:
Jul. 11, 2014
Shinko Electric Industries Co., Ltd., Nagano-shi, Nagano, JP;
Kentaro Kaneko, Nagano, JP;
Kazuhiro Kobayashi, Nagano, JP;
Toshimitsu Omiya, Nagano, JP;
Kotaro Kodani, Nagano, JP;
Shunichiro Matsumoto, Nagano, JP;
Ruofan Tang, Nagano, JP;
SHINKO ELECTRIC INDUSTRIES CO., LTD., Nagano-Shi, JP;
Abstract
A wiring substrate includes an insulating layer, a pad, and a solder resist layer. The insulating layer has a first surface formed with a first recess portion. The pad is embedded in the first recess portion. The pad includes a second surface and a third surface. The third surface that is located at a lower position than the first surface so as to expose an inner wall surface of the first recess portion. The pad is formed with a second recess portion in a center portion of the third surface. The solder resist layer is provided on the first surface. An adjacent portion of the first surface to a peripheral portion of the first recess portion is smaller in roughness than a region of the first surface peripheral to the adjacent portion of the first surface.