The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 26, 2016

Filed:

Feb. 20, 2015
Applicant:

E I Du Pont DE Nemours and Company, Wilmington, DE (US);

Inventors:

Giuseppe Scardera, Sunnyvale, CA (US);

Dmitry Poplavskyy, San Jose, CA (US);

Daniel Aneurin Inns, Palo Alto, CA (US);

Karim Lotfi Bendimerad, San Francisco, CA (US);

Shannon Dugan, Sunnyvale, CA (US);

Assignee:

E I DU PONT DE NEMOURS AND COMPANY, Wilmington, DE (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/00 (2006.01); H01L 31/0224 (2006.01); H01L 31/18 (2006.01); H01L 31/068 (2012.01); H01L 31/02 (2006.01);
U.S. Cl.
CPC ...
H01L 31/022441 (2013.01); H01L 31/0201 (2013.01); H01L 31/022433 (2013.01); H01L 31/0682 (2013.01); H01L 31/1804 (2013.01); Y02P 70/521 (2015.11);
Abstract

A method for manufacturing an interdigitated back contact solar cell, comprising steps of: (a) providing a doped silicon substrate; (b) doping the rear surface of the substrate homogeneously with boron in a blanket pattern, thereby forming a p+ region on the rear surface of the silicon substrate; (c) forming a silicon dioxide layer on the front and rear surface; (d) depositing a phosphorus-containing doping paste on the rear surface in a second pattern; (e) heating the silicon substrate to locally diffuse phosphorus into the rear surface of the silicon substrate, thereby forming an n+ region on the rear surface of the silicon substrate through the second pattern, wherein the p+ region and the n+ region on the rear surface collectively form an interdigitated pattern; and (f) removing the second silicon dioxide layer from the silicon substrate.


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