The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 26, 2016

Filed:

Jul. 02, 2013
Applicant:

Infineon Technologies Ag, Neubiberg, DE;

Inventors:

Roland Rupp, Lauf an der Pegnitz, DE;

Christian Hecht, Buckenhof, DE;

Bernd Leonhard Zippelius, Erlangen, DE;

Assignee:

Infineon Technologies AG, Neubiberg, DE;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 29/15 (2006.01); H01L 29/06 (2006.01); H01L 29/16 (2006.01); H01L 29/32 (2006.01); H01L 29/34 (2006.01); H01L 29/66 (2006.01); H01L 29/78 (2006.01);
U.S. Cl.
CPC ...
H01L 29/0607 (2013.01); H01L 29/1608 (2013.01); H01L 29/32 (2013.01); H01L 29/34 (2013.01); H01L 29/66068 (2013.01); H01L 29/7827 (2013.01);
Abstract

A silicon carbide device includes an epitaxial silicon carbide layer having a first conductivity type and a buried lateral silicon carbide edge termination region within the epitaxial silicon carbide layer and having a second conductivity type. The buried lateral silicon carbide edge termination region is covered by a silicon carbide surface layer including a doping of ions of a transition metal or including an increased density of intrinsic point defects in comparison to a density of intrinsic point defects of the buried lateral silicon carbide edge termination region.


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