The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 26, 2016
Filed:
Jun. 27, 2012
Applicants:
Holger Torwesten, Regensburg, DE;
Manfred Mengel, Bad Abbach, DE;
Inventors:
Holger Torwesten, Regensburg, DE;
Manfred Mengel, Bad Abbach, DE;
Assignee:
INFINEON TECHNOLOGIES AG, Neubiberg, DE;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/00 (2006.01); H01L 23/00 (2006.01); H01L 23/29 (2006.01); H01L 23/495 (2006.01); H01L 23/31 (2006.01); H01L 21/56 (2006.01);
U.S. Cl.
CPC ...
H01L 24/83 (2013.01); H01L 23/293 (2013.01); H01L 23/3121 (2013.01); H01L 23/49513 (2013.01); H01L 23/49582 (2013.01); H01L 24/29 (2013.01); H01L 24/92 (2013.01); H01L 21/561 (2013.01); H01L 24/05 (2013.01); H01L 24/06 (2013.01); H01L 24/32 (2013.01); H01L 24/73 (2013.01); H01L 2224/0346 (2013.01); H01L 2224/0401 (2013.01); H01L 2224/04026 (2013.01); H01L 2224/04042 (2013.01); H01L 2224/04105 (2013.01); H01L 2224/0566 (2013.01); H01L 2224/05568 (2013.01); H01L 2224/05582 (2013.01); H01L 2224/05611 (2013.01); H01L 2224/05618 (2013.01); H01L 2224/05624 (2013.01); H01L 2224/05639 (2013.01); H01L 2224/05644 (2013.01); H01L 2224/05647 (2013.01); H01L 2224/05655 (2013.01); H01L 2224/05664 (2013.01); H01L 2224/05666 (2013.01); H01L 2224/05672 (2013.01); H01L 2224/06181 (2013.01); H01L 2224/12105 (2013.01); H01L 2224/131 (2013.01); H01L 2224/2731 (2013.01); H01L 2224/27332 (2013.01); H01L 2224/27334 (2013.01); H01L 2224/2912 (2013.01); H01L 2224/2919 (2013.01); H01L 2224/2929 (2013.01); H01L 2224/29082 (2013.01); H01L 2224/29105 (2013.01); H01L 2224/29109 (2013.01); H01L 2224/29111 (2013.01); H01L 2224/29113 (2013.01); H01L 2224/29116 (2013.01); H01L 2224/29118 (2013.01); H01L 2224/29139 (2013.01); H01L 2224/29144 (2013.01); H01L 2224/29155 (2013.01); H01L 2224/29294 (2013.01); H01L 2224/29339 (2013.01); H01L 2224/29344 (2013.01); H01L 2224/29347 (2013.01); H01L 2224/32245 (2013.01); H01L 2224/48245 (2013.01); H01L 2224/48247 (2013.01); H01L 2224/73253 (2013.01); H01L 2224/73265 (2013.01); H01L 2224/83192 (2013.01); H01L 2224/83439 (2013.01); H01L 2224/83447 (2013.01); H01L 2224/83825 (2013.01); H01L 2224/83855 (2013.01); H01L 2224/92 (2013.01); H01L 2224/9202 (2013.01); H01L 2224/92143 (2013.01); H01L 2224/92147 (2013.01); H01L 2224/94 (2013.01); H01L 2224/95 (2013.01); H01L 2924/00014 (2013.01); H01L 2924/07802 (2013.01); H01L 2924/1305 (2013.01); H01L 2924/13055 (2013.01); H01L 2924/15747 (2013.01); H01L 2924/181 (2013.01);
Abstract
A method for manufacturing a chip package is provided, the method including: forming a layer arrangement over a carrier; arranging a chip including one or more contact pads over the layer arrangement wherein the chip covers at least part of the layer arrangement; and selectively removing one or more portions of the layer arrangement and using the chip as a mask such that at least part of the layer arrangement covered by the chip is not removed.