The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
A method for manufacturing a chip package is provided, the method including: forming a layer arrangement over a carrier; arranging a chip including one or more contact pads over the layer arrangement wherein the chip covers at least part of the layer arrangement; and selectively removing one or more portions of the layer arrangement and using the chip as a mask such that at least part of the layer arrangement covered by the chip is not removed.
Torwesten, Holger. (2016). Method for manufacturing a chip package (U.S. Patent No. 9245868). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/9245868
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
