The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 26, 2016
Filed:
Dec. 15, 2014
Xilinx, Inc., San Jose, CA (US);
Woon-Seong Kwon, Cupertino, CA (US);
Suresh Ramalingam, Fremont, CA (US);
XILINX, INC., San Jose, CA (US);
Abstract
In an example, an integrated circuit (IC) package includes a package substrate, an IC die, solder bumps, a first plurality of trenches, and underfill material. The IC die includes a front surface and a back surface, the front surface facing the package substrate and including a conductive interface. The solder bumps couple the conductive interface to the package substrate. The first plurality of trenches includes at least one trench proximate each corner of the IC die formed in the front surface of the IC die in an area between the conductive interface and a perimeter of the IC die. The underfill material is disposed between the front surface of the IC die and the package substrate, the underfill material being in contact with the first plurality of trenches.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile