The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 26, 2016
Filed:
Jun. 01, 2015
Novatek Microelectronics Corp., Hsinchu, TW;
Jhih-Siou Cheng, New Taipei, TW;
Tzu-Chiang Lin, Hsinchu, TW;
Chia-En Wu, New Taipei, TW;
Chun-Yung Cho, Hsinchu County, TW;
Cheng-Hung Chen, Hsinchu County, TW;
Ju-Lin Huang, Hsinchu County, TW;
Novatek Microelectronics corp., Hsinchu, TW;
Abstract
A chip package structure includes a package body. The package body includes a core circuit and an electrostatic discharge protection circuit. A first connection terminal electrically is connected to the core circuit. A second connection terminal electrically is connected to the electrostatic discharge protection circuit. A first interconnection structure electrically connected to the electrostatic discharge protection circuit, the second connection terminal and a third connection terminal. A first lead electrically connects the second connection terminal and an external circuit. A second lead electrically connects the first connection terminal and the third connection terminal. The second lead and the first lead are substantially separate.