Integrated circuits and methods of forming the same with multiple embedded interconnect connection to same through-semiconductor via

Abstract

Integrated circuits, methods of forming integrated circuits, and methods of sensing voiding between a through-semiconductor via and a subsequent layer that overlies the through-semiconductor via in integrated circuits are provided. An exemplary method of forming an integrated circuit includes forming a plurality of semiconductor devices on a semiconductor substrate. A through-semiconductor via is formed in the semiconductor substrate, and an interlayer dielectric layer is formed that overlies the through-semiconductor via and the plurality of semiconductor devices. A first interconnect via is embedded within the interlayer dielectric layer, and a second interconnect via is embedded within the interlayer dielectric layer. The first interconnect via and the second interconnect via are in electrical communication with the through-semiconductor via at spaced locations from each other on the through-semiconductor via.