The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 26, 2016

Filed:

Jan. 22, 2010
Applicants:

John Larson, Iii, Palo Alto, CA (US);

Sergey Mishin, Goleta, CA (US);

Inventors:

John Larson, III, Palo Alto, CA (US);

Sergey Mishin, Goleta, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C23C 14/34 (2006.01); C23C 14/06 (2006.01); C23C 14/00 (2006.01); C23C 14/02 (2006.01); C23C 14/22 (2006.01); H03H 3/007 (2006.01);
U.S. Cl.
CPC ...
C23C 14/0617 (2013.01); C23C 14/0036 (2013.01); C23C 14/02 (2013.01); C23C 14/022 (2013.01); C23C 14/0641 (2013.01); C23C 14/228 (2013.01); C23C 14/345 (2013.01); H03H 2003/0071 (2013.01);
Abstract

In accordance with a representative embodiment, a method of fabricating a piezoelectric material comprising a first component and a second component comprises: providing a substrate; flowing hydrogen over the substrate; flowing the first component to form the piezoelectric material over a target; and sputtering the piezoelectric material from the target on the substrate. In accordance with another representative embodiment, a method of fabricating a bulk acoustic wave (BAW) resonator comprises: forming a first electrode over a substrate; forming a seed layer over the substrate; and depositing a piezoelectric material having a compression-negative (C) polarity. The depositing of the piezoelectric material comprises: flowing a first component of the piezoelectric material to form the piezoelectric material over a target comprising a second component of the piezoelectric material; and sputtering the piezoelectric material from the target to the substrate.


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