The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 9240393 B1

PDF
Full Text
Expired
Date of Patent:
Jan. 19, 2016

Filed:

Aug. 01, 2014
Applicant:

Sandisk Information Technology (Shanghai) Co., Ltd., Shanghai, CN;

Inventors:

Cheeman Yu, Fremont, CA (US);

Zhong Lu, Shanghai, CN;

Gursharan Singh, Fremont, CA (US);

Wei Gu, Shanghai, CN;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 25/065 (2006.01); H01L 23/31 (2006.01); H01L 25/00 (2006.01); H01L 21/66 (2006.01);
U.S. Cl.
CPC ...
H01L 25/0657 (2013.01); H01L 23/3135 (2013.01); H01L 25/50 (2013.01); H01L 22/14 (2013.01); H01L 2224/04042 (2013.01); H01L 2224/32145 (2013.01); H01L 2224/32225 (2013.01); H01L 2224/45139 (2013.01); H01L 2224/45144 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/48145 (2013.01); H01L 2224/48227 (2013.01); H01L 2224/49175 (2013.01); H01L 2224/73265 (2013.01); H01L 2224/78301 (2013.01); H01L 2224/85205 (2013.01); H01L 2224/92247 (2013.01); H01L 2225/0651 (2013.01); H01L 2225/06506 (2013.01); H01L 2225/06562 (2013.01); H01L 2924/15311 (2013.01); H01L 2924/15313 (2013.01); H01L 2924/19107 (2013.01);
Abstract

A semiconductor device including two or more die stacks mounted to a substrate. The first die stack is mounted, at least partially encapsulated, and then tested. If the first die stack functions within predefined parameters, a second die stack is mounted on the first die stack, and then the device may undergo a second encapsulation process. Testing the first die stack before mounting the second improves yield by identifying faulty semiconductor die before all die are mounted within the semiconductor device.


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