The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 12, 2016
Filed:
Dec. 24, 2012
Applicant:
Unimicron Technology Corp., Taoyuan, TW;
Inventors:
Tsung-Yuan Chen, Taoyuan County, TW;
Shu-Sheng Chiang, Taipei, TW;
David C. H. Cheng, Taoyuan County, TW;
Assignee:
Unimicron Technology Corp., Taoyuan, TW;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H05K 1/00 (2006.01); H05K 1/02 (2006.01); H05K 3/04 (2006.01); H05K 3/10 (2006.01); H05K 3/46 (2006.01); H05K 1/11 (2006.01); H05K 3/42 (2006.01);
U.S. Cl.
CPC ...
H05K 1/02 (2013.01); H05K 1/0265 (2013.01); H05K 1/0298 (2013.01); H05K 1/115 (2013.01); H05K 3/045 (2013.01); H05K 3/107 (2013.01); H05K 3/465 (2013.01); H05K 3/426 (2013.01); H05K 2201/0352 (2013.01); H05K 2201/09736 (2013.01); Y10T 29/4913 (2015.01); Y10T 29/49117 (2015.01); Y10T 29/49126 (2015.01); Y10T 29/49155 (2015.01);
Abstract
A circuit board structure including a dielectric layer, a fine circuit pattern and a patterned conductive layer is provided, wherein the fine circuit pattern is embedded in a surface of the dielectric layer, and the patterned conductive layer is disposed on another surface of the dielectric layer and protrudes therefrom.