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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 9236364 B1

PDFFull Text
Expired
Date of Patent:
Jan. 12, 2016

Filed:

Nov. 22, 2013

Package carrier and manufacturing method thereof

Applicant:

Subtron Technology Co., Ltd., Hsinchu County, TW;

Inventor:

Shih-Hao Sun, Hsinchu County, TW;

Assignee:

Subtron Technology Co., Ltd., Hsinchu County, TW;

Attorney:

Jianq Chyun IP Office

Primary Examiner:

Xiaoliang Chen

Int. Cl.
CPC ...
H05K 1/09 (2006.01); H01L 23/00 (2006.01); H05K 1/11 (2006.01); H01L 21/48 (2006.01); H01L 21/683 (2006.01); H01L 23/31 (2006.01); H01L 23/495 (2006.01); H01L 21/56 (2006.01);
U.S. Cl.
CPC ...
H01L 24/85 (2013.01); H01L 21/4825 (2013.01); H01L 21/4832 (2013.01); H01L 21/6835 (2013.01); H01L 23/49582 (2013.01); H01L 24/81 (2013.01); H01L 24/83 (2013.01); H05K 1/09 (2013.01); H05K 1/111 (2013.01); H01L 21/568 (2013.01); H01L 23/3128 (2013.01); H01L 23/49541 (2013.01); H01L 24/16 (2013.01); H01L 24/29 (2013.01); H01L 24/32 (2013.01); H01L 24/48 (2013.01); H01L 2221/68345 (2013.01); H01L 2221/68359 (2013.01); H01L 2224/16245 (2013.01); H01L 2224/2919 (2013.01); H01L 2224/32245 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/48105 (2013.01); H01L 2224/48245 (2013.01); H01L 2224/81005 (2013.01); H01L 2224/8149 (2013.01); H01L 2224/81439 (2013.01); H01L 2224/81444 (2013.01); H01L 2224/81447 (2013.01); H01L 2224/83005 (2013.01); H01L 2224/8349 (2013.01); H01L 2224/83439 (2013.01); H01L 2224/83444 (2013.01); H01L 2224/83447 (2013.01); H01L 2224/85 (2013.01); H01L 2224/85005 (2013.01); H01L 2224/8549 (2013.01); H01L 2224/85439 (2013.01); H01L 2224/85444 (2013.01); H01L 2224/85447 (2013.01); H01L 2924/00014 (2013.01); H01L 2924/15311 (2013.01); H01L 2924/181 (2013.01);
Abstract

A manufacturing method of a package carrier includes the following steps. Firstly, two base metal layers are bonded together. Then, two supporting layers are laminated onto the base metal layers respectively. Next, two release metal films are disposed on the supporting layers respectively, wherein each of the release metal films includes a first metal film and a second metal film separable from each other. Next, two patterned metal layers are formed on the release metal films respectively, wherein each of the patterned metal layers is suitable for carrying and electrically connected to a chip. Then, the base metal layers are separated from each other to form two package carriers independent from each other. A package carrier formed by the manufacturing method described above is also provided.

Find Patent Forward Citations

Sun, Shih-Hao. (2016). Package carrier and manufacturing method thereof (U.S. Patent No. 9236364). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/9236364

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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