The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 12, 2016
Filed:
Mar. 01, 2012
Kentaro Kaneko, Nagano, JP;
Toshiaki Aoki, Nagano, JP;
Hiromi Denda, Nagano, JP;
Shinko Electric Industries Co., Ltd., Nagano-ken, JP;
Abstract
A wiring substrate includes a wiring layer, an outermost insulating layer laminated to the wiring layer, and a pad electrically connected to the wiring layer and exposed from a surface of the outermost insulating layer. The pad consists essentially of a first metal layer and a second metal layer. The first metal layer includes a first surface, which is exposed from the surface of the outermost insulating layer, and a second surface, which is located opposite to the first surface. The second metal layer includes is formed between the second surface of the first metal layer and the wiring layer. The first metal layer is formed from a metal selected from gold or silver or from an alloy including at least one of gold and silver. The second metal layer is formed from palladium or a palladium alloy.