The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 12, 2016

Filed:

Aug. 09, 2012
Applicants:

Toshimasa Nagoshi, Hitachi, JP;

Shigeo Tanaka, Hitachi, JP;

Inventors:

Toshimasa Nagoshi, Hitachi, JP;

Shigeo Tanaka, Hitachi, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G03F 7/038 (2006.01); G03F 7/004 (2006.01); G03F 7/027 (2006.01); H05K 3/28 (2006.01); C08G 59/18 (2006.01); C08L 63/00 (2006.01); C08L 63/10 (2006.01);
U.S. Cl.
CPC ...
G03F 7/0388 (2013.01); C08G 59/186 (2013.01); C08L 63/00 (2013.01); C08L 63/10 (2013.01); G03F 7/0047 (2013.01); G03F 7/027 (2013.01); G03F 7/038 (2013.01); G03F 7/0385 (2013.01); H05K 3/287 (2013.01); H05K 2201/0209 (2013.01);
Abstract

The present invention provides a photosensitive resin composition comprising an (a) component: an acid-modified epoxy resin, a (b) component: a photopolymerizable monomer having an ethylenically unsaturated group, a (c) component: a photopolymerization initiator, a (d) component: an epoxy resin, and an (e) component: an inorganic filler, wherein the (a) component comprises an acid-modified bisphenol novolak type epoxy resin and further the photosensitive resin composition satisfies a predetermined condition, and provides a photosensitive film, a permanent resist and a method for producing a permanent resist using the same.


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