The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 12, 2016
Filed:
Mar. 19, 2010
Yasuhisa Sano, Osaka, JP;
Kazuto Yamauchi, Osaka, JP;
Junji Murata, Osaka, JP;
Shun Sadakuni, Osaka, JP;
Keita Yagi, Tokyo, JP;
Yasuhisa Sano, Osaka, JP;
Kazuto Yamauchi, Osaka, JP;
Junji Murata, Osaka, JP;
Shun Sadakuni, Osaka, JP;
Keita Yagi, Tokyo, JP;
OSAKA UNIVERSITY, Osaka, JP;
EBARA CORPORATION, Tokyo, JP;
Abstract
A polishing method can process and flatten, in a practical processing time and with high surface accuracy, a surface of a substrate of a Ga element-containing compound semiconductor. The polishing method includes: bringing a Ga element-containing compound semiconductor substrate () into contact with a polishing tool () in the presence of a processing solution () comprising a neutral pH buffer solution containing Ga ions; irradiating a surface of the substrate with light or applying a bias potential to the substrate, or applying a bias potential to the substrate while irradiating the surface of the substrate with light, thereby forming Ga oxide () on the surface of the substrate; and simultaneously moving the substrate and the polishing tool relative to each other to polish and remove the Ga oxide formed on the surface of the substrate.