The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 05, 2016

Filed:

Apr. 02, 2015
Applicant:

Globalfoundries Inc., Grand Cayman, KY;

Inventors:

John J. Benoit, Williston, VT (US);

James R. Elliott, Richmond, VT (US);

Peter B. Gray, Jericho, VT (US);

Alvin J. Joseph, Williston, VT (US);

Qizhi Liu, Lexington, MA (US);

Christa R. Willets, Jericho, VT (US);

Assignee:

GLOBALFOUNDRIES INC., Grand Cayman, KY;

Attorneys:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 29/732 (2006.01); H01L 29/66 (2006.01); H01L 29/06 (2006.01); H01L 29/737 (2006.01);
U.S. Cl.
CPC ...
H01L 29/732 (2013.01); H01L 29/0649 (2013.01); H01L 29/66272 (2013.01); H01L 29/7378 (2013.01);
Abstract

Device structures, design structures, and fabrication methods for a bipolar junction transistor. A first layer comprised of a first semiconductor material and a second layer comprised of a second semiconductor material are disposed on a substrate containing a first terminal of the bipolar junction transistor. The second layer is disposed on the first layer and a patterned etch mask is formed on the second layer. A trench extends through the pattern hardmask layer, the first layer, and the second layer and into the substrate. The trench defines a section of the first layer stacked with a section of the second layer. A selective etching process is used to narrow the section of the second layer relative to the section of the first layer to define a second terminal and to widen a portion of the trench in the substrate to undercut the section of the first layer.


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