The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 05, 2016

Filed:

Jun. 23, 2015
Applicant:

Taiwan Semiconductor Manufacturing Company, Ltd., Hsin-Chu, TW;

Inventors:

Hsiu-Jung Yen, Shuishang Township, TW;

Jen-Pan Wang, Tainan, TW;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/336 (2006.01); H01L 29/49 (2006.01); H01L 29/66 (2006.01); H01L 21/3213 (2006.01); H01L 21/306 (2006.01); H01L 21/31 (2006.01); H01L 21/3205 (2006.01); H01L 21/321 (2006.01); H01L 49/02 (2006.01); H01L 21/768 (2006.01); H01L 21/8234 (2006.01);
U.S. Cl.
CPC ...
H01L 29/49 (2013.01); H01L 21/30604 (2013.01); H01L 21/31 (2013.01); H01L 21/3212 (2013.01); H01L 21/32051 (2013.01); H01L 21/32133 (2013.01); H01L 21/76895 (2013.01); H01L 21/823437 (2013.01); H01L 21/823462 (2013.01); H01L 21/823468 (2013.01); H01L 21/823475 (2013.01); H01L 28/20 (2013.01); H01L 29/66545 (2013.01);
Abstract

A method comprises forming a gate trench between a plurality of gate spacers over a substrate, forming a resistor trench over the substrate, depositing a first layer on a bottom of the gate trench, a bottom of the resistor trench, sidewalls of the gate trench and sidewalls of the resistor trench, depositing a second layer over the first layer, depositing a gate electrode layer over the second layer and applying a chemical mechanical polish process to the gate electrode layer until the gate electrode layer is removed from the resistor trench.


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