The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 05, 2016

Filed:

Mar. 07, 2015
Applicant:

Alpha and Omega Semiconductor Incorporated, Sunnyvale, CA (US);

Inventors:

Xiaotian Zhang, San Jose, CA (US);

Hua Pan, Shanghai, CN;

Ming-Chen Lu, Shanghai, CN;

Jun Lu, San Jose, CA (US);

Hamza Yilmaz, Saratoga, CA (US);

Assignee:
Attorneys:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 25/00 (2006.01); H01L 23/00 (2006.01); H01L 23/495 (2006.01); H01L 25/07 (2006.01); H01L 23/492 (2006.01); H01L 21/304 (2006.01); H01L 21/56 (2006.01); H01L 21/78 (2006.01); H01L 21/66 (2006.01); H01L 23/367 (2006.01); H01L 25/065 (2006.01); H01L 23/433 (2006.01);
U.S. Cl.
CPC ...
H01L 25/50 (2013.01); H01L 21/304 (2013.01); H01L 21/56 (2013.01); H01L 21/78 (2013.01); H01L 22/14 (2013.01); H01L 23/3675 (2013.01); H01L 23/492 (2013.01); H01L 23/49503 (2013.01); H01L 23/49524 (2013.01); H01L 23/49534 (2013.01); H01L 23/49562 (2013.01); H01L 23/49575 (2013.01); H01L 24/11 (2013.01); H01L 24/27 (2013.01); H01L 24/33 (2013.01); H01L 24/37 (2013.01); H01L 24/40 (2013.01); H01L 24/49 (2013.01); H01L 24/81 (2013.01); H01L 24/83 (2013.01); H01L 24/85 (2013.01); H01L 24/97 (2013.01); H01L 25/0652 (2013.01); H01L 25/07 (2013.01); H01L 23/4334 (2013.01); H01L 24/05 (2013.01); H01L 24/06 (2013.01); H01L 24/48 (2013.01); H01L 2224/05553 (2013.01); H01L 2224/05554 (2013.01); H01L 2224/0603 (2013.01); H01L 2224/118 (2013.01); H01L 2224/13022 (2013.01); H01L 2224/32245 (2013.01); H01L 2224/37013 (2013.01); H01L 2224/40137 (2013.01); H01L 2224/40145 (2013.01); H01L 2224/40247 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/48106 (2013.01); H01L 2224/48145 (2013.01); H01L 2224/48177 (2013.01); H01L 2224/48247 (2013.01); H01L 2224/48465 (2013.01); H01L 2224/49111 (2013.01); H01L 2224/49113 (2013.01); H01L 2224/49171 (2013.01); H01L 2224/73263 (2013.01); H01L 2224/73265 (2013.01); H01L 2224/8385 (2013.01); H01L 2224/83851 (2013.01); H01L 2225/0651 (2013.01); H01L 2225/06506 (2013.01); H01L 2225/06572 (2013.01); H01L 2225/06589 (2013.01); H01L 2924/00014 (2013.01); H01L 2924/0781 (2013.01); H01L 2924/07802 (2013.01); H01L 2924/1305 (2013.01); H01L 2924/13055 (2013.01); H01L 2924/13091 (2013.01);
Abstract

A stacked multi-chip packaging structure comprises a lead frame, a first semiconductor chip mounted on the lead frame, a second semiconductor chip flipped-chip mounted on the lead frame, a metal clip mounted on top of the first and second semiconductor chips and a third semiconductor chip stacked on the metal clip; bonding wires electrically connecting electrodes on the third semiconductor chip to the first and second semiconductor chips and the pins of the lead frame; plastic molding encapsulating the lead frame, the chips and the metal clip.


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