The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 05, 2016

Filed:

Sep. 04, 2012
Applicants:

Theordore D Moustakas, Dover, MA (US);

Adrian D Williams, Methuen, MA (US);

Inventors:

Theordore D Moustakas, Dover, MA (US);

Adrian D Williams, Methuen, MA (US);

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/3065 (2006.01); H01L 31/0304 (2006.01); H01L 21/302 (2006.01); H01L 21/306 (2006.01); H01L 21/02 (2006.01); H01L 21/66 (2006.01); H01L 33/00 (2010.01); H01L 33/32 (2010.01);
U.S. Cl.
CPC ...
H01L 21/3065 (2013.01); H01L 21/02019 (2013.01); H01L 21/302 (2013.01); H01L 21/30621 (2013.01); H01L 31/03044 (2013.01); H01L 22/12 (2013.01); H01L 22/20 (2013.01); H01L 33/007 (2013.01); H01L 33/32 (2013.01); Y02E 10/544 (2013.01);
Abstract

Films of III-nitride for semiconductor device growth are planarized using an etch-back method. The method includes coating a III-nitride surface having surface roughness features in the micron range with a sacrificial planarization material such as an appropriately chosen photoresist. The sacrificial planarization material is then etched together with the III-nitride roughness features using dry etch methods such as inductively coupled plasma reactive ion etching. By closely matching the etch rates of the sacrificial planarization material and the III-nitride material, a planarized III-nitride surface is achieved. The etch-back process together with a high temperature annealing process yields a planarized III-nitride surface with surface roughness features reduced to the nm range. Planarized III-nitride, e.g., GaN, substrates and devices containing them are also provided.


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