The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 05, 2016
Filed:
Mar. 30, 2007
Antonio Castro, Hillsboro, OR (US);
Mohammad Al-aqrabawi, Hillsboro, OR (US);
Brad A. Kelly, Hillsboro, OR (US);
Rehan Sheikh, Portland, OR (US);
Antonio Castro, Hillsboro, OR (US);
Mohammad Al-Aqrabawi, Hillsboro, OR (US);
Brad A. Kelly, Hillsboro, OR (US);
Rehan Sheikh, Portland, OR (US);
Intel Corporation, Santa Clara, CA (US);
Abstract
A high volume manufacturing (HVM) and circuit marginality validation (CMV) test for an integrated circuit (IC) is disclosed. The IC comprises a port binding and bubble logic in the front end to provide flexibility in binding a port to the uop and to create empty spaces (bubbles) in the uop flow. The out-of-order (OOO) cluster of the IC comprises reservation disable logic to control the flow sequence of the uops and stop schedule logic to temporarily stop dispatching the uops from the OOO cluster to the execution (EXE) cluster. The EXE cluster of the IC comprises signal event uops to generate fault information and fused uJump uops to specify combination of branch prediction, direction, and resolution in any portion of the test. Such features provide a tester the flexibility to perform HVM and CMV testing of the OOO and EXE clusters of the IC.