The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 05, 2016
Filed:
Oct. 29, 2014
Freescale Semiconductor, Inc., Austin, TX (US);
Stephen R. Hooper, Mesa, AZ (US);
Philip H. Bowles, San Diego, CA (US);
FREESCALE SEMICONDUCTOR, INC., Austin, TX (US);
Abstract
A method () of forming a semiconductor package () entails applying () an adhesive () to a portion () of a bonding perimeter () of a base (), with a section () of the perimeter () being without the adhesive (). A lid () is placed on the base () so that a bonding perimeter () of the lid () abuts the bonding perimeter () of the base (). The lid () includes a cavity () in which dies () mounted to the base () are located. A gap () is formed without the adhesive () at the section () between the base () and the lid (). The structure vents from the gap () as air inside the cavity () expands during heat curing (). Following heat curing (), another adhesive () is dispensed in the section () to close the gap () and seal the cavity ().