The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 29, 2015

Filed:

Dec. 11, 2014
Applicant:

International Business Machines Corporation, Armonk, NY (US);

Inventors:

Sean M. Polvino, Brooklyn, NY (US);

Shahab Siddiqui, White Plains, NY (US);

Assignee:

GLOBALFOUNDRIES INC., Grand Cayman, KY;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 21/8242 (2006.01); H01L 27/108 (2006.01); H01L 29/66 (2006.01);
U.S. Cl.
CPC ...
H01L 27/10861 (2013.01); H01L 27/10879 (2013.01); H01L 27/1082 (2013.01); H01L 27/10826 (2013.01); H01L 27/10838 (2013.01); H01L 27/10858 (2013.01); H01L 29/66181 (2013.01); H01L 2924/1436 (2013.01);
Abstract

A method of deep trench isolation which includes: forming a semiconductor on insulator (SOI) substrate comprising a bulk semiconductor substrate, a buried insulator layer and a semiconductor layer on the buried insulator layer (SOI layer), one portion of the SOI substrate having a dynamic random access memory buried in the bulk semiconductor substrate (eDRAM) and a deep trench fin contacting the eDRAM and a second portion of the SOI substrate having an SOI fin in contact with the buried insulator layer; conformally depositing sequential layers of oxide, high-k dielectric material and sacrificial oxide on the deep trench fin and the SOI fin; stripping the sacrificial oxide over the SOI fin to expose the high-k dielectric material over the SOI fin; stripping the exposed high-k dielectric material over the SOI fin to expose the oxide layer over the SOI fin.


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