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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 9224684 B1

PDFFull Text
Date of Patent:
Dec. 29, 2015

Filed:

Jan. 29, 2014

Wiring board and method of manufacturing wiring board

Applicant:

Shinko Electric Industries Co., Ltd., Nagano-shi, Nagano, JP;

Inventors:

Kazuyuki Kubota, Nagano, JP;

Tomoharu Fujii, Nagano, JP;

Assignee:

SHINKO ELECTRIC INDUSTRIES CO., LTD., Nagano-Shi, JP;

Attorney:

Rankin, Hill & Clark LLP

Primary Examiner:

Xiaoliang Chen

Int. Cl.
CPC ...
H05K 1/16 (2006.01); H01L 23/50 (2006.01); H05K 1/02 (2006.01); H05K 3/46 (2006.01); H01L 23/58 (2006.01); H01L 25/10 (2006.01); H05K 1/18 (2006.01); H05K 3/10 (2006.01); H05K 3/42 (2006.01);
U.S. Cl.
CPC ...
H01L 23/50 (2013.01); H01L 23/58 (2013.01); H05K 1/0271 (2013.01); H05K 3/4602 (2013.01); H01L 25/105 (2013.01); H01L 2224/16237 (2013.01); H01L 2924/15321 (2013.01); H05K 1/16 (2013.01); H05K 1/185 (2013.01); H05K 3/108 (2013.01); H05K 3/429 (2013.01); H05K 3/462 (2013.01); H05K 3/4644 (2013.01); H05K 2201/0162 (2013.01); H05K 2201/0187 (2013.01); H05K 2201/0195 (2013.01); H05K 2201/0218 (2013.01); H05K 2201/0355 (2013.01); H05K 2201/09536 (2013.01); H05K 2201/10037 (2013.01); H05K 2201/10151 (2013.01); H05K 2203/1461 (2013.01); H05K 2203/1469 (2013.01);
Abstract

There is provided a wiring board. The wiring board includes: a first insulating layer; a secondary battery on one surface of the first insulating layer; a second insulating layer formed on the secondary battery; a third insulating layer covering the second insulating layer; a first wiring layer on one surface of the third insulating layer; and a via electrically connecting the first wiring layer to an electrode of the secondary battery. A rigidity of the second insulating layer is lower than those of the first and third insulating layers.

Find Patent Forward Citations

Kubota, Kazuyuki. (2015). Wiring board and method of manufacturing wiring board (U.S. Patent No. 9224684). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/9224684

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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