The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 29, 2015

Filed:

Sep. 27, 2010
Applicants:

Manfred Rietzler, Marktoberdorf, DE;

Ulrich Lang, Bangkok, TH;

Inventors:

Manfred Rietzler, Marktoberdorf, DE;

Ulrich Lang, Bangkok, TH;

Assignee:

SMARTRAC IP B.V., Amsterdam, NL;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01P 11/00 (2006.01); G06K 19/077 (2006.01); H01L 23/00 (2006.01); H01L 21/48 (2006.01);
U.S. Cl.
CPC ...
G06K 19/07749 (2013.01); G06K 19/0775 (2013.01); H01L 24/80 (2013.01); H01L 24/81 (2013.01); H01L 24/83 (2013.01); H01L 21/4814 (2013.01); H01L 2224/2919 (2013.01); H01L 2224/29099 (2013.01); H01L 2224/83127 (2013.01); H01L 2224/83192 (2013.01); H01L 2224/83207 (2013.01); H01L 2224/83385 (2013.01); H01L 2924/01005 (2013.01); H01L 2924/01006 (2013.01); H01L 2924/01013 (2013.01); H01L 2924/01019 (2013.01); H01L 2924/01029 (2013.01); H01L 2924/01033 (2013.01);
Abstract

The invention relates to a method for contacting a chip with a conductor arrangement and also to a conductor arrangement, particularly a transponder antenna, an intermediate carrier or the like, with a carrier substrate () for accommodating the chip and with a chip having chip terminal faces formed thereon, wherein a conductor material layer () is formed on the carrier substrate, wherein the conductor material layer forms a conductor arrangement () having at least two conductors () which are connected to each other in a chip contact area (), wherein an insulating gap () is formed in the chip contact area, such that mutually electrically insulated conductor terminal faces () of the conductors are formed, wherein the chip terminal faces are contacted with the conductor terminal faces, and wherein the insulating gap is formed by removal of the conductor material layer by means of a laser.


Find Patent Forward Citations

Rietzler, Manfred. (2015). Method for contacting a chip (U.S. Patent No. 9224086). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/9224086

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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